Senior Package Designer

Position Summary The Senior Packaging Designer (BGA & Substrate & WLCSP) is responsible for product and tooling design. Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position. Responsibilities With reference to internal design guidelines, work with the internal & external customer to: - Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers. - Generate test vehicle design and